Heat-radiating fin set formed by combining a heat pipe and several heat-radiating fins

ABSTRACT

An improved heat-radiating fin set formed by combining a heat pipe and several heat-radiating fins can assemble several fins for heat radiation of an electronic component. The improved heat-radiating fin set can be quickly mass-produced in an automatic way to lower the manufacturing and assembly cost without using any solder material for binding. The improved heat-radiating fin set comprises a heat pipe and several fins. A sleeve hole is disposed in each fin. A flange is formed at the edge of each of the sleeve holes. The fins are tightly sleeved with the heat pipe through the sleeve holes with the flanges of the sleeve holes of the fins touching the outer wall of the heat pipe.

BACKGROUND OF THE INVENTION

As shown in FIGS. 1 and 2, a conventional heat-radiating fin setcomprises a pipe body 12, several fins 11, and a solder bar 13. Each ofthe fins 11 has a through hole 111 and is sleeved with the pipe body 12through the through hole 111. A gap 112 is further formed at the throughhole 111 of each of the fins 11. After the fins 11 are stacked togetherone by one, the solder bar 13 penetrates the channel formed of theconnected gaps 112 (or solder paste (not shown) is provided at inneredges of the through holes 111 of the fins 11). After passing a solderfurnace and heated, the solder bar 13 (or solder paste) will be meltedto bind the pipe body 12 and the through holes 111 of the fins 11together, hence forming the conventional heat-radiating fin set 1.

For the above conventional heat-radiating fin set 1, however, the finsare applied with solder paste and then assembled one by one so that themanufacturing and assembly cost is high and automatic and quickproduction can't be accomplished. Moreover, because there is stillisolation of solder material (the solder bar or solder paste) betweenthe fins 11 and the pipe body 12, conduction of heat will be blocked tocause reduction of the heat conduction efficiency.

Accordingly, the present invention aims to propose an improvedheat-radiating fin set formed by combining a heat pipe and severalheat-radiating fins to solve the above problems in the prior art.

1. Field of the Invention

The present invention relates to an improved heat-radiating fin setformed by combining a heat pipe and several heat-radiating fins and,more particularly, to a heat-radiating fin set capable of assemblingseveral fins for heat radiation of an electronic component (e.g., aCPU).

2. Description of Related Art

SUMMARY OF THE INVENTION

An object of the present invention is to provide an improvedheat-radiating fin set formed by combining a heat pipe and severalheat-radiating fins to effectively match an exclusive manufacturingmachine so that quick and mass production can be accomplished in anautomatic way for the manufacturing and assembly of the heat-radiatingfin set, thereby effectively lowering the manufacturing and assemblycost.

Another object of the present invention is to provide an improvedheat-radiating fin set formed by combining a heat pipe and severalheat-radiating fins to effectively avoid isolation of solder materialbetween the fins and the heat pipe so that the heat-radiating efficiencywon't be lowered.

To achieve the above objects, the present invention provides an improvedheat-radiating fin set formed by combining a heat pipe and severalheat-radiating fins to facilitate the operation of a stamping machine.The improved heat-radiating fin set comprises a heat pipe and severalfins each having a sleeve hole and a flange formed at the edge of thesleeve hole. The fins are tightly sleeved with the heat pipe through thesleeve holes with the flanges of the sleeve holes of the fins touchingthe outer wall of the heat pipe.

The various objects and advantages of the present invention will be morereadily understood from the following detailed description when read inconjunction with the appended drawing, in which:

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exploded perspective view of a conventional heat-radiatingfin set;

FIG. 2 is a perspective assembly view of a conventional heat-radiatingfin set;

FIG. 3 is an exploded perspective view of a heat-radiating fin set ofthe present invention;

FIG. 4 is a perspective assembly view of a heat-radiating fin set of thepresent invention;

FIG. 5 is a perspective view of a single fin of a heat-radiating fin setof the present invention; and

FIG. 6 is a cross-sectional view of a heat-radiating fin set of thepresent invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

As shown in FIGS. 3 to 6, the present invention provides an improvedheat-radiating fin set 2 formed by combining a heat pipe and severalheat-radiating fins. The heat-radiating fin set 2 comprises a heat pipe22 and several fins 21, which are sleeved with the heat pipe 22 andstacked together one by one. The improved heat-radiating fin set 2 needsto effectively match an exclusive manufacturing machine (e.g., astamping machine) so that quick and mass production can be accomplishedin an automatic way for the manufacturing and assembly of theheat-radiating fin set, thereby effectively lowering the manufacturingand assembly cost.

The heat pipe 22 is used to quickly conduct heat from its one end to theother end for increasing the heat-radiating efficiency of various heatradiators or heat-radiating devices. The heat pipe 22 can be a roundpipe, a flat pipe or a pipe body including any round or flat shape.

Each of the fins 21 has a sleeve hole 211. A flange 212 is formed at theedge of each of the sleeve holes 211 to increase the contact area ofeach of the fins 21 with the heat pipe 22 and also enhance the fixingeffect.

The fins 21 are tightly sleeved with the heat pipe 22 through the sleeveholes 211. The bore diameter of the sleeve holes 211 of the fins 21 issmaller than outer diameter of the heat pipe 22 before being sleevedwith the heat pipe 22. Therefore, the fins 21 will compel open the borediameter of the sleeve holes 211 to be tightly sleeved with the heatpipe 22 without using any solder material (e.g., solder paste) forbinding when being sleeved with the heat pipe 22.

In addition to the U-shape having two opposite sidewalls shown in FIG.5, the fins 21 can also be of an L-shape (not shown) having only asidewall or pf an I-shape (not shown) having no sidewall. Because nosolder material (e.g., solder paste) is required for binding, not onlyreduction of the heat conduction efficiency due to the solder materialwon't occur, the operation of a stamping machine (not shown) will alsobe facilitated. One only needs to entrust manufacturing procedures likehole punching, shaping, hole expanding, edge bending, and cutting to thestamping machine for continuous stamping and then provide themanufactured fins 21 for the stamping machine for subsequent operations.The fins 21 can be led to move and sleeved with the vertical andimmobile heat pipe 22 one by one (from top to bottom) in accordance withthe longitudinal to-and-fro motion of the stamping machine. Of course,it is also feasible that the heat pipe 22 be sleeved with the immobilefins 21. The assembly of the heat-radiating fin set of the presentinvention can thus be accomplished. The structure of the heat-radiatingfin set of the present invention can exactly facilitate the operation ofthe stamping machine to accomplish quick and mass production in anautomatic way, thereby effectively lowering the manufacturing andassembly cost.

To sum up, the present invention can accomplish quick and massproduction of an improved heat-radiating fin set formed by combining aheat pipe and several heat-radiating fins in an automatic way, and canalso avoid reduction of the heat-radiating efficiency due to soldermaterial (e.g., solder paste) for binding.

Although the present invention has been described with reference to thepreferred embodiment thereof, it will be understood that the inventionis not limited to the details thereof. Various substitutions andmodifications have been suggested in the foregoing description, andother will occur to those of ordinary skill in the art. Therefore, allsuch substitutions and modifications are intended to be embraced withinthe scope of the invention as defined in the appended claims.

1. A heat-radiating fin set formed by combining a heat pipe and severalheat-radiating fins to facilitate the operation of a stamping machinecomprising: a heat pipe; and several fins each having a sleeve hole anda flange formed at an edge of said sleeve hole, said fins being tightlysleeved with said heat pipe through said sleeve holes with said flangesof said sleeve holes of said fins touching an outer wall of said heatpipe.
 2. The heat-radiating fin set formed by combining a heat pipe andseveral heat-radiating fins as claimed in claim 1, wherein the borediameter of said sleeve hole of each said fin is smaller than the outerdiameter of said heat pipe before said fin is sleeved with said heatpipe.
 3. The heat-radiating fin set formed by combining a heat pipe andseveral heat-radiating fins as claimed in claim 1, wherein said fins areI-shaped.
 4. The heat-radiating fin set formed by combining a heat pipeand several heat-radiating fins as claimed in claim 1, wherein said finsare L-shaped.
 5. The heat-radiating fin set formed by combining a heatpipe and several heat-radiating fins as claimed in claim 1, wherein saidfins are U-shaped.
 6. The heat-radiating fin set formed by combining aheat pipe and several heat-radiating fins as claimed in claim 1, whereinsaid heat pipe is sleeved into said sleeve holes of said fins one by onein accordance with a longitudinal motion of said stamping machine. 7.The heat-radiating fin set formed by combining a heat pipe and severalheat-radiating fins as claimed in claim 1, wherein said fins are led tomove and sleeved with said vertical and immobile heat pipe one by one inaccordance with a longitudinal motion of said stamping machine.